| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SAK-TC333LP-32F200FAA | IC |
INFINEON/英飞凌 |
LQFP-100 |
24+ |
20000 |
|||
| MGD3160AM515EKR2 | IC |
NXP/恩智浦 |
SSOP-32 |
24+ |
10000 |
|||
| NX5032GA-20.000M-STD-CSU-2 | IC |
NDK/电波 |
SMD |
23+ |
15000 |
|||
| SDM-660-3-692NSP-TR-01-A-AA | IC |
QUALCOMM/高通 |
BGA |
23+ |
5000 |
|||
| P2020NSN2MHC | 其他被动元件 |
NXP/恩智浦 |
BGA |
23+ |
2000 |
|||
| 559090874 | 手机连接器 |
MOLEX/莫仕 |
connector |
23+ |
20000 |
|||
| TPS48111LQDGXRQ1 | IC |
TI/德州仪器 |
VSSOP19 |
25+ |
40000 |
|||
| SSDPE2KE032T8 | INTEL英特尔 |
N/A |
23+ |
5000 |
||||
| TPS7B4254QDDARQ1 | IC |
TI/德州仪器 |
SOP8 |
25+ |
30000 |
|||
| DRV401AIRGWR | IC |
TI/德州仪器 |
QFN20 |
25+ |
50000 |
|||
| 9H03200083 | IC |
TXC/台湾晶技 |
SMD |
23+ |
20000 |
|||
| H58G76BK8HX095N | IC |
SKHYNIX/海力士 |
BGA |
23+ |
100 |
|||
| AWR6843ABGABLRQ1 | IC |
TI/德州仪器 |
FCCSP161 |
23+ |
8000 |
|||
| ATXMEGA64A3U-MHR | IC |
MICROCHIP/微芯 |
VQFN64 |
23+ |
50000 |
|||
| S912ZVMAL3F0MLF | IC |
NXP/恩智浦 |
LQFP48 |
24+ |
30000 |
|||
| UJA1169TK/F | IC |
NXP/恩智浦 |
HVSON-20 |
23+ |
6000 |
|||
| EP3C10E144C8N | IC |
INTEL/英特尔 |
QFP144 |
24+ |
10000 |
|||
| LTC2633AHTS8-LO12#TRMPBF | IC |
ADI/亚德诺 |
SOT23-8 |
22+ |
60000 |
|||
| STPS5H100AFY | 整流器件 |
ST/意法 |
SOD-128 |
23+ |
80000 |
|||
| BCM53262MKPBG | 其他被动元件 |
BROADCOM/博通 |
BGA |
23+ |
5000 |
|||
| PC82573L | IC |
INTEL英特尔 |
BGA |
23+ |
2000 |
|||
| TLC6C5724QDAPRQ1 |
|
IC |
TI/德州仪器 |
HTSSOP38 |
23+ |
10000 |
||
| BUK9Y19-55B,115 |
|
IC |
NEXPERIA/安世 |
SOT-669 |
24+ |
50000 |
||
| PM-4250-0-FOWNSP144-TR-00-0 | Qualcomm高通 |
BGA |
23+ |
5000 |
||||
| MAX4995AAVB+TCJY | IC |
MAXIM/美信 |
QFN |
23+ |
50000 |
|||
| LM4050QAEM3X5.0/NOPB | IC |
TI/德州仪器 |
SOT-23 |
25+ |
25000 |
|||
| PDS3959 | IC |
HAMOS/汉姆 |
SOP-8 |
24+ |
20000 |
|||
| SDM-450-B-792NSP-TR-01-0-AA | IC |
QUALCOMM/高通 |
BGA |
22+ |
4000 |
|||
| SI8442AB-D-IS1R | IC |
SILICON/芯科 |
SOIC-16 |
22+ |
5000 |
|||
| LMV324IYDT | IC |
ST/意法 |
23+ |
60000 |