| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| 7448421016 | IC |
WURTH/伍尔特 |
SMD |
24+ |
5000 |
|||
| OS12D40-J08A-001A | IC |
OmniVision豪威 |
SMD |
24+ |
2400 |
|||
| XC7A100T-2FGG484C | 单片机MCU |
XILINX/赛灵思 |
BGA |
23+ |
1000 |
|||
| TEF8102EN/N1Y | IC |
NXP/恩智浦 |
FBGA155 |
23+ |
20000 |
|||
| S9S08SC4E0MTGR | IC |
NXP/恩智浦 |
TSSOP16 |
23+ |
50000 |
|||
| LIF-MD6000-6MG81I | 单片机MCU |
LATTICE/莱迪斯 |
BGA |
23+ |
5000 |
|||
| F3L200R12W2H3_B11 | IC |
INFINEON/英飞凌 |
MODULE |
23+ |
5000 |
|||
| SC2210-MS1NN00 | IC |
SMARTSENS/思特威 |
CSP |
23+ |
20000 |
|||
| MT8102NSBR | IC |
M3TEK/莱颉 |
SOT23-5 |
23+ |
20000 |
|||
| GD25Q128ESIGR | IC |
GD/兆易创新 |
NA |
23+ |
2636 |
|||
| S-LMBR360FT1G | IC |
LRC/乐山 |
SOD-123FL |
24+ |
150000 |
|||
| QDM-3301-0-LGA55D-TR-02-0 | QUALCOMM/高通 |
BGA |
23+ |
5000 |
||||
| DS90UB933TRTVRQ1 | IC |
TI/德州仪器 |
WQFN32 |
23+ |
50000 |
|||
| T40XP | IC |
INGENIC/君正 |
BGA |
23+ |
2000 |
|||
| THCV235 | THINE/塞恩 |
QFN64 |
23+ |
5000 |
||||
| DO1608C-222MLC | 功率电感 |
COILCRAFT/线艺 |
SMD |
23+ |
50000 |
|||
| OS05A20-H73A-1C | IC |
OMNIVISION/豪威科技 |
CSP |
24+ |
20000 |
|||
| 5CEFA9U19C7N | IC |
ALTERA/阿尔特拉 |
BGA |
23+ |
2000 |
|||
| PI6C20800SIVEX | IC |
PERICOM/百利通 |
TSSOP-48 |
23+ |
2000 |
|||
| LM76002QRNPRQ1 | 电源IC |
TI/德州仪器 |
WQFN-30 |
22+ |
20000 |
|||
| SN74ALVTH16245GR | IC |
TI/德州仪器 |
TSSOP48 |
22+ |
30000 |
|||
| C3M0015065K | IC |
WOLFSPEED |
TO-247-4 |
23+ |
50000 |
|||
| BCM56331B1IFSBLG | IC |
BROADCOM/博通 |
BGA |
22+ |
2000 |
|||
| SC4210-CSBNN00 | SMARTSENS/思特威 |
CSP |
23+ |
20000 |
||||
| PM-660-0-219WLPSP-TR-02-1 | IC |
QUALCOMM/高通 |
BGA |
22+ |
8000 |
|||
| 53647-1274 | 手机连接器 |
MOLEX/莫仕 |
connector |
23+ |
20000 |
|||
| MC33887APVWR2 | IC |
NXP/恩智浦 |
HSOP20 |
23+ |
30000 |
|||
| TLV9062QDGKRQ1 | IC |
TI/德州仪器 |
VSSOP8 |
25+ |
25000 |
|||
| LM5164QDDARQ1 | IC |
TI/德州仪器 |
HSOIC-8 |
25+ |
40000 |
|||
| ISO7741FQDWRQ1 | IC |
TI/德州仪器 |
SOP16 |
25+ |
40000 |