| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LMR33620AQRNXRQ1 | IC |
TI/德州仪器 |
VQFN12 |
25+ |
50000 |
|||
| GCJ55DR72J224KXJ1 | MURATA/村田 |
SMD |
23+ |
20000 |
||||
| MC33887APVW | IC |
NXP/恩智浦 |
HSOP-20 |
22+ |
10000 |
|||
| ADG2128YCPZ-REEL7 | IC |
ADI/亚德诺 |
LFCSP-32 |
22+ |
15000 |
|||
| L9680TR | IC |
ST/意法 |
LQFP-100 |
24+ |
50000 |
|||
| TLE4252D |
|
IC |
INFINEON/英飞凌 |
TO-252-5 |
22+ |
50000 |
||
| MC68HC908GR4CFAE | IC |
NXP/恩智浦 |
QFP32 |
23+ |
50000 |
|||
| 747370009 | IC |
MOLEX/莫仕 |
NA |
23+ |
5000 |
|||
| H27U2G8F2CTR-BC | 存储IC |
SKHYNIX/海力士 |
TSOP48 |
23+ |
1000 |
|||
| SGM8600XTDE8G/TR | 运放IC |
SGMICRO/圣邦微 |
QFN |
23+ |
25000 |
|||
| PM-8004-0-63BWLNSP-TR-00-0 | 工控元件 |
QUALCOMM/高通 |
BGA |
23+ |
10000 |
|||
| THCV242A-P | IC |
THINE/赛恩 |
QFN64 |
22+ |
5000 |
|||
| TLV1805QDBVRQ1 | IC |
TI/德州仪器 |
SOT23-6 |
25+ |
30000 |
|||
| OPA316QDBVRQ1 | IC |
TI/德州仪器 |
SOT-23-5 |
25+ |
20000 |
|||
| LM5155QDSSRQ1 | IC |
TI/德州仪器 |
WSON-12 |
25+ |
35000 |
|||
| Hi3796MRTCV20100000 | HISILICON/海思 |
BGA |
24+ |
30000 |
||||
| B82477R4103M100 |
|
功率电感 |
TDK/东电化 |
SMD |
23+ |
35000 |
||
| L9953LXPTR | IC |
ST/意法 |
SSOP36 |
24+ |
50000 |
|||
| SMS-R050-0.5 | IC |
ISA/伊萨 |
22+ |
25000 |
||||
| MAX96701GTG/V+T | IC |
ADI/亚德诺 |
TQFN24 |
24+ |
50000 |
|||
| AI7688H |
|
IC |
ACSIP/群登科技 |
MODULE |
22+ |
6000 |
||
| MSM381A3729H9BP |
|
IC |
MEMS/敏芯微 |
SMD |
23+ |
57000 |
||
| BUK7M6R0-40H | IC |
NEXPERIA/安世 |
N/A |
25+ |
100000 |
|||
| SDM-660-3-692NSP-TR-01-A-AA | IC |
QUALCOMM/高通 |
BGA |
23+ |
5000 |
|||
| P2020NSN2MHC | 其他被动元件 |
NXP/恩智浦 |
BGA |
23+ |
2000 |
|||
| 559090874 | 手机连接器 |
MOLEX/莫仕 |
connector |
23+ |
20000 |
|||
| AWR6843ABGABLRQ1 | IC |
TI/德州仪器 |
FCCSP161 |
23+ |
8000 |
|||
| DRV401AIRGWR | IC |
TI/德州仪器 |
QFN20 |
25+ |
50000 |
|||
| TPS7B4254QDDARQ1 | IC |
TI/德州仪器 |
SOP8 |
25+ |
30000 |
|||
| 9H03200083 | IC |
TXC/台湾晶技 |
SMD |
23+ |
20000 |