型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
---|---|---|---|---|---|---|---|---|
T40XP | IC |
INGENIC/君正 |
BGA |
23+ |
2000 |
|||
THCV235 | THINE/塞恩 |
QFN64 |
23+ |
5000 |
||||
DO1608C-222MLC | 功率电感 |
COILCRAFT/线艺 |
SMD |
23+ |
50000 |
|||
MC33887APVWR2 | IC |
NXP/恩智浦 |
HSOP20 |
23+ |
50000 |
|||
OS05A20-H73A-1C | IC |
OMNIVISION/豪威科技 |
CSP |
24+ |
20000 |
|||
L9781 | IC |
ST/意法 |
LQFP64 |
23+ |
80000 |
|||
5CEFA9U19C7N | IC |
ALTERA/阿尔特拉 |
BGA |
23+ |
2000 |
|||
PI6C20800SIVEX | IC |
PERICOM/百利通 |
TSSOP-48 |
23+ |
2000 |
|||
BCM56331B1IFSBLG | IC |
BROADCOM/博通 |
BGA |
22+ |
2000 |
|||
560020-0620 | IC |
MOLEX/莫仕 |
NA |
23+ |
30000 |
|||
SC4210-CSBNN00 | SMARTSENS/思特威 |
CSP |
23+ |
20000 |
||||
PM-660-0-219WLPSP-TR-02-1 | IC |
QUALCOMM/高通 |
BGA |
22+ |
8000 |
|||
S34ML04G100TFI000 | IC |
SPANSION/飞索半导体 |
23+ |
10000 |
||||
53647-1274 | 手机连接器 |
MOLEX/莫仕 |
connector |
23+ |
20000 |
|||
LM76002QRNPRQ1 | 电源IC |
TI/德州仪器 |
WQFN-30 |
22+ |
20000 |
|||
SN74ALVTH16245GR | IC |
TI/德州仪器 |
TSSOP48 |
22+ |
30000 |
|||
C3M0015065K | IC |
WOLFSPEED |
TO-247-4 |
23+ |
50000 |
|||
S34ML01G100TFI000 | 存储IC |
SPANSION/飞索半导体 |
TSOP48 |
22+ |
10000 |
|||
H27U2G8F2CTR-BC | 存储IC |
SKHYNIX/海力士 |
TSOP48 |
23+ |
1000 |
|||
TPA2031D1YZFR | IC |
TI/德州仪器 |
DSBGA9 |
23+ |
3000 |
|||
MSM381A3729H9BP | MEMS/敏芯微 |
SMD |
24+ |
20000 |
||||
Hi3796MRTCV20100000 | HISILICON/海思 |
BGA |
22+ |
30000 |
||||
MT53D1024M32D4DT-053 AIT:D | IC |
MICRON/美光 |
BGA |
23+ |
8000 |
|||
AI7688H | IC |
ACSIP/群登科技 |
MODULE |
22+ |
10000 |
|||
SGM8600XTDE8G/TR | 运放IC |
SGMICRO/圣邦微 |
QFN |
23+ |
25000 |
|||
XC95144XL-10TQG144C | 单片机MCU |
XILINX/赛灵思 |
TQFP144 |
23+ |
6000 |
|||
THCV242A-P | IC |
THINE/赛恩 |
QFN64 |
22+ |
5000 |
|||
B82477R4103M100 | 功率电感 |
TDK/东电化 |
SMD |
23+ |
30000 |
|||
MPC8313VRAFFC | 工控元件 |
FREESCALE/飞思卡尔 |
BGA |
23+ |
5000 |
|||
AU5325BC2-QMR | IC |
AURASEMI/宁波奥拉 |
NA |
23+ |
2000 |