| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DTC114YUAFRAT106 | IC |
ROHM/罗姆 |
23+ |
48000 |
||||
| TLV1805QDBVRQ1 | IC |
TI/德州仪器 |
SOT23-6 |
25+ |
30000 |
|||
| OPA316QDBVRQ1 | IC |
TI/德州仪器 |
SOT-23-5 |
25+ |
20000 |
|||
| LM5155QDSSRQ1 | IC |
TI/德州仪器 |
WSON-12 |
25+ |
35000 |
|||
| H27U2G8F2CTR-BC | 存储IC |
SKHYNIX/海力士 |
TSOP48 |
23+ |
1000 |
|||
| SGM8600XTDE8G/TR | 运放IC |
SGMICRO/圣邦微 |
QFN |
23+ |
25000 |
|||
| THCV242A-P | IC |
THINE/赛恩 |
QFN64 |
22+ |
5000 |
|||
| MPC8313VRAFFC | 工控元件 |
FREESCALE/飞思卡尔 |
BGA |
23+ |
5000 |
|||
| PM-8004-0-63BWLNSP-TR-00-0 | 工控元件 |
QUALCOMM/高通 |
BGA |
23+ |
10000 |
|||
| LN4292T1G | IC |
LRC/乐山 |
SOP-8 |
23+ |
50000 |
|||
| 747370009 | IC |
MOLEX/莫仕 |
NA |
23+ |
5000 |
|||
| Hi3796MRTCV20100000 | HISILICON/海思 |
BGA |
24+ |
30000 |
||||
| MAX9924UAUB | IC |
MAXIM/美信 |
MSOP10 |
23+ |
60000 |
|||
| MAX96701GTG/V+T | IC |
ADI/亚德诺 |
24+ |
50000 |
||||
| L9953LXPTR | IC |
ST/意法 |
24+ |
50000 |
||||
| AI7688H |
|
IC |
ACSIP/群登科技 |
MODULE |
22+ |
2560 |
||
| B82477R4103M100 |
|
功率电感 |
TDK/东电化 |
SMD |
23+ |
35000 |
||
| MSM381A3729H9BP |
|
IC |
MEMS/敏芯微 |
SMD |
23+ |
22800 |
||
| SMS-R050-0.5 | IC |
ISA/伊萨 |
22+ |
25000 |
||||
| SDM-660-3-692NSP-TR-01-A-AA | IC |
QUALCOMM/高通 |
BGA |
23+ |
5000 |
|||
| THC63LVD104C | 其他被动元件 |
THINE/塞恩 |
TQFP64 |
23+ |
10000 |
|||
| P2020NSN2MHC | 其他被动元件 |
NXP/恩智浦 |
BGA |
23+ |
2000 |
|||
| 559090874 | 手机连接器 |
MOLEX/莫仕 |
connector |
23+ |
20000 |
|||
| TPS48111LQDGXRQ1 | IC |
TI/德州仪器 |
VSSOP19 |
25+ |
40000 |
|||
| AWR6843ABGABLRQ1 | IC |
TI/德州仪器 |
FCCSP161 |
23+ |
8000 |
|||
| ATXMEGA64A3U-MHR | IC |
MICROCHIP/微芯 |
VQFN64 |
23+ |
50000 |
|||
| BCM5461SA2KQMG | IC |
BROADCOM/博通 |
QFP128 |
22+ |
10000 |
|||
| UJA1169TK/F | IC |
NXP/恩智浦 |
23+ |
6000 |
||||
| S912ZVMAL3F0MLF | IC |
NXP/恩智浦 |
LQFP48 |
24+ |
30000 |
|||
| 900-82888-0040-000 | IC |
NVIDIA/英伟达 |
N/A |
23+ |
1000 |